Resin Bond Diamond Dicing Blade
  • Resin Bond Diamond Dicing BladeResin Bond Diamond Dicing Blade

Resin Bond Diamond Dicing Blade

Bilah dicing resin cocog kanggo nglereni bahan sing rapuh lan rapuh, kayata QFN, safir, kuarsa lan kaca, lan liya-liyane. Sampeyan bisa santai kanggo tuku Resin Bond Diamond Dicing Blade saka pabrik.

Kirim Pitakonan

Deskripsi Produk

* Kemampuan nglereni apik banget sing mbantu nyuda chipping, retak lan permukaan sing mulus

* Dicing bahan keras lan rapuh. Kayata QFN / MLF, Substrat Keramik Kandel lan Kaca, lsp

* Bisa ngontrol konsentrasi intan kanthi tepat kanggo nggayuh kualitas nglereni

* Matriks ngasah awake dhewe kanggo mbukak intan anyar. Ukuran grit berlian wiwit saka 3μm nganti 250μm gumantung saka ketebalan agul-agul

Aplikasi Resin Bond Diamond Dicing Blade

Kaca (piranti optik, serat optik), kuarsa (splitter optik, piranti gergaji), LiTa03 LiNb03 (piranti), cetakan epoxy QFN (copper), splitter, safir

dicing blades for glass, quartz, QFN, sapphire

Hot Tags: Resin Bond Diamond Dicing Blade, Produsen, Suplier, Grosir, Tuku, Disesuaikan, Stok, Sampel Gratis, China, Pabrik, Digawe ing China
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